Sun Semiconductor s China-Hong Kong factory FAB3B construction plan is in full swing and is expected to be put into production in 2028

Sun Semiconductor, a major recycled wafer manufacturer, announced on the 8th that the construction plan of its China-Hong Kong factory FAB3B is in full swing and is expected to be officially put into production in 2028. The new factory is planned to have four floors above ground and one underground floor, and its designed production capacity will exceed the 600,000 pieces/month scale of the existing China-Hong Kong factory FAB3A. This expansion of production will not only strengthen Sun Semiconductor's leading position in the global recycled wafer market, but will also deepen the breadth and depth of cooperation with major international customers and promote the company's long-term development in the advanced process supply chain.

Sun Semiconductor CEO Cai Xingchuan pointed out that as of the third quarter, Sun Semiconductor's revenue increased by 31.53% year-on-year, and its market value has exceeded NT$30 billion, reflecting the market's recognition of the company's operating results and long-term development. While growing steadily, the company adheres to the principle of putting safety and quality first, and maintains its leading position as the world's largest recycled wafer production capacity with leading technology and innovation capabilities.

Sun Semiconductor stated that with safety commitment, smart manufacturing and production capacity layout as the core, it has demonstrated its determination to continue to lead the recycled wafer industry. First of all, in order to consolidate its leading position in the advanced process supply chain, Sun Semiconductor will increase the existing FAB3A production capacity of its China-Hong Kong factory from 300,000 pieces/month in 2025 to 600,000 pieces/month in 2026. It will also spend approximately NT$1.85 billion to expand the new smart factory (FAB3B), which is expected to be put into operation in 2028. By then, the overall production capacity will be doubled again, forming a complete recycled wafer Mega Fab pattern, with larger-scale and flexible supply capabilities, and rapid response to the needs of major global customers.

In addition, Sun Semiconductor takes technological innovation as its core driving force and introduces a new generation manufacturing architecture that combines AI, high-speed transportation and smart warehousing to create a fully automated lights-off factory. Through smart scheduling and high-speed transportation networks, the process cycle is greatly shortened, efficiency and flexibility are improved, and the existing automation foundation is combined and continuously upgraded on the existing automation basis to further strengthen the company's competitive advantage in the field of smart manufacturing.

Finally, Sun Semiconductor continues to implement the SQS (Triple Guard) management system, including Safety to create a safe and healthy environment, Quality to ensure stable quality, and Security to strengthen information security and compliance. Through SQS, we will comprehensively improve operational resilience, implement sustainability commitments, and move towards the ultimate goal of zero disasters, zero defects, and zero risks.

Sun Semiconductor emphasized that by continuing to deepen its smart manufacturing and production capacity layout, the company was ranked among the "Top 100 Foreign-Selected Taiwan Enterprises (FINI 100)" in 2025, demonstrating its high trust in the international capital market. The company will also use stable quality, fast service and flexible production capacity to shape the differentiated advantages of the industry and continue to create a new semiconductor landscape that is both resilient and competitive.